2025 24th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic
Dates | May 27-30, 2025 |
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Location | Dallas, Texas, United States |
Organizer | IEEE Electronics Packaging Society |
Topics | |
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems. |
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