2027 26th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Dates	May 25-28, 2027
Location	Aurora, Colorado, United States
Organizer	IEEE Electronics Packaging Society
Topics	Engineering Materials Science and Engineering Telecommunications and Networks
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.

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