2030 29th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic

Dates	May 28-31, 2030
Location	Aurora, Colorado, United States
Organizer	IEEE Electronics Packaging Society
Topics	Electrical and Electronic Engineering Engineering Materials Science and Engineering
The ITherm Conference series is the leading international venue for scientific and engineering exploration of thermal, thermomechanical, and emerging technology issues associated with electronic devices, packages, and systems.

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